The modular 3D camera system with onboard processing
The Ensenso XR series combines the flexible, modular design of the Ensenso X series with the advantages of an embedded system. The new powerful XR projector unit with integrated system on chip processes the image data independently, making 3D data available directly from the camera. The 3D performance of the XR series can compete with that of a powerful Core i7 desktop CPU. By shifting the compute-intensive calculations to the camera, they no longer have to be performed by powerful industrial PCs. In addition, the transfer of 3D result data instead of high-resolution 2D raw data reduces the network load. Multi-camera systems in particular benefit from the resource-saving features of the new XR series.
A built-in front light supports calibrating the work environment as well as the image quality of the 2D camera images. Besides the GigE data connection, an additional WiFi interface is planned, which will be very useful for temporary access to data and parameters when wiring is difficult or cost-intensive.
Each Ensenso XR30 3D camera system consists of the new XR projector unit, two IDS GigE cameras with CMOS sensors, mounting brackets, three lenses and patch cables to connect the cameras with the XR projector unit. Due to the IP65/67 protection class, the system also contains lens tubes for the cameras and the projector in addition to special cables.
The 3D systems are delivered mounted and calibrated. With the easy-to-use setup wizard of the Ensenso software, calibration and focusing is nevertheless very easy to perform yourself.
- 3D object recognition, classification & localization, e.g. quality assurance, commissioning
- 3D object reconstruction
- Factory automation
- Capture of objects up to 8 m³, e.g, enitre rooms, pallets
- Robot applications, e.g. bin picking
- Conveyor belt picking
- Logistics automation. e.g. (De-)Palletizing
- Automatic storage systems